Education and working experience:

• 1987~1991 Department of Chemistry , Fudan University, Undergraduate student

• 1991~1994 Department of Chemistry , Fudan University, Master's degree

• 1994~1997 Department of Chemistry , Fudan University, Ph.D. Postgraduates

• 1997~    Department of Materials Science , Fudan University, associate professor

Lecturer course

• Fundamentals of Material Chemistry，Undergraduate Course

• Thin Film Material Technology，Undergraduate Course

• Chemical treatment of electronic materials，Undergraduate Course

• Material synthesis and preparation，Postgraduate courses

• Characterization of Composites ，Postgraduate courses

Research Interests:

• surface analysis

• failure analysis

• Functional materials

• Microelectronic Packaging Technology

• Protection of cultural relics

Honors and Recognition:

• Third Award of Fifth Award for Scientific and Technological Achievements in Safety Production

Key Publications:

1. Effect of Cu Lead-Frame Oxidation Time on Cu/EMC Interfaces in Power Devices，Semiconductor Technology，Fang Xing, Fang Qiang, Wang Jun, Yu Hongkun, Shao Xuefeng，2010

2. Palladium Coverage on Free Air Balls of Palladium-Coated Copper Wires Bonding，Semiconductor Technology，Pu Haonan, Wang Jiaji, Yu Hongkun，2013

3. Microstructure of Sputtered Titanium Nano-Layer in the Package Substrate，Semiconductor Technology，Lu Ping , Yu Hongkun , Lo kuanglin, Ou Hsien Hsun, Huang Jianhua, Lu Songtao，2014

4. reparation of Nano-porous Copper Film with Bio-gel Plating，Chinese Journal of Applied Chemistry，ZHOU Nianyun, YU Hongkun，2015

5. Textural Property Studies of Intangible Cultural Heritage Guizhou Danzhai Traditional Hand-Making Paper，Journal of Fudan University（Natural Science），YAN Yue＇er, YU Hongkun, YU Hui, JIN Chao, YANG Guanghui, TANG Yi，2016

6. Novel Ag2S nanoparticles on reduced graphene oxide sheets as a super-efficient catalyst for the reduction of 4-nitrophenol，Chinese Chemical Letters,，Bin Lang ,，Hong-Kun Yu ，2017