Education

• 1979.9. - 1983.8.  Fudan University, Department of Chemistry (B. S.)

• 1983.9. - 1986.8.  Fudan University, Department of Chemistry (M. S.)

• 1986.9. - 1991.12.  Shanghai Institute of Organic Chemistry (Chinese Academy of Science) (Ph. D.)

• 1989.12. - 1991.7.  University of Saarlandes (Germany), (Visiting Scholar)

Experiences

• 1992.3. - 1997.5.  Fudan University, Center for Analysis & Measurement

• 1997.6. - present  Fudan University, Department of Materials

• 2000.3. - 2000.12. Eastern Michigan University, Coatings Research Institute (Visiting Scholar)

• 2005.1. - 2006.11. Georgia Institute of Technology, School of Materials Science and Engineering (Visiting Scholar)

Biography

Dr. Fei Xiao is a Professor in the Department of Materials Science at Fudan University. He received his B.S. degree in chemistry in 1983 and M.S. degree in organic chemistry in 1986 from Fudan University, and a Ph.D. degree in organic chemistry in 1991 from Shanghai Institute of Organic Chemistry, Chinese Academy of Science. He has been working at Fudan University since 1992. His research interests lie in the fields of electronic materials, electronic packaging and interconnect. He has published over 80 peer-reviewed journal papers and holds over 20 Chinese patents in the area of functional materials and electronic packaging.

Research Interests

• Novel electronic materials for packaging and interconnects

Key Publications

1.Low temperature self-reducible copper hydroxide amino-alcohol complex catalyzed by formic acid for conductive copper films. Tianke Qi, Zhaoqiang Zhang, Yan Li, Jianzhong Wang, Fei Xiao*. Journal of Materials Chemistry C, 2018, 6, 11320-11327. 

2.Long-term stable silver nanowire transparent composite as bottom electrode for perovskite solar cells. Yunxia Jin, Yong Sun, Kaiqing Wang, Yani Chen, Ziqi Liang, Yuxi Xu*, Fei Xiao*. Nano Research, 2018, 11(4), 1998-2011. 

3.Removable Large-Area Ultrasmooth Silver Nanowire Transparent Composite Electrode. Yunxia Jin, Kaiqing Wang, Yuanrong Cheng, Qibing Pei, Yuxi Xu*, Fei Xiao*, ACS Applied Materials & Interfaces, 2017, 9 (5), 4733-4741. 

4.Mixed ink of copper nanoparticles and copper formate complex with low sintering temperatures. Yan Li, Tianke Qi, Miao Chen, Fei Xiao*, Journal of Materials Science: Materials in Electronics, 2016, 27(11), 11432-11438. 

5.High-performance intrinsic low-k polymer via the synergistic effect of its three units: adamantyl, perfluorocyclobutylidene and benzocyclobutene. Lingqiang Kong, Tianke Qi, Zhidong Ren, Yunxia Jin, Yan Li, Yuanrong Cheng, Fei Xiao*, RSC Advances, 2016, 6, 68560-68567. 

6.Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization. Jia Xi, Xinduo Zhai, Jun Wang, Donglun Yang, Mao Ru, Fei Xiao*, Li Zhang, Chi Ming Lai, Journal of Electronic Packaging, 2015, 137(3), 031016. 

7.Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity. Lingqiang Kong, Yuanrong Cheng, Yunxia Jin, Zhidong Ren, Yan Li, Fei Xiao*, Journal of Materials Chemistry C, 2015, 3(14), 3364-3370. 

8.Cohesively Enhanced Conductivity and Adhesion of Flexible Silver Nanowire Networks by Biocompatible Polymer Sol-Gel Transition. Yunxia Jin, Lu Li, Yuanrong Cheng, Lingqiang Kong, Qibing Pei, Fei Xiao*, Advanced Functional Materials, 2015, 25, 1581-1587. 

9.Annealing-free, long-term reliable and strongly adhesive silver nanowire networks by introduction of nonconductive and biocompatible polymer binder. Yunxia Jin, Dunying Deng, Yuanrong Cheng, Lingqiang Kong, Fei Xiao*, Nanoscale, 2014, 6(9), 4812-4818. 

10.Site-Selective Growth of Patterned Silver Grid Networks as Flexible Transparent Conductive Film by Using Poly(dopamine) at Room Temperature. Yunxia Jin, Yuanrong Cheng, Dunying Deng, Chengjie Jiang, Tianke Qi, Donglun Yang, Fei Xiao*, ACS Applied Materials & Interfaces, 2014, 6(3), 1447-1453.