吕银祥

 性别:男             
 出生年份: 1976年
 职称:教授/博导
 联系电话:021-55665059   
 Email:yxlu@fudan.edu.cn

简历/经历

  • 1994年9月至2004年1月,复旦大学化学系本科、材料科学系博士
  • 2004年4月至今,复旦大学材料科学系讲师、副教授、教授、博导
  • 2009年2月至2010年2月,东京工业大学电子化学系访问学者

                        
研究方向(包括任教课程)
研究方向:
可穿戴电子材料、环境修复材料

任教课程:
物理化学B、有机信息材料导论、材料与社会、印刷电子学

 
代表性成果
在研项目:
[1] 国家自然科学基金面上项目“0.25 微米线宽柔性电路板的研制及其关键问题研究(61371019)”,2014.1~2017.12
[2] 江苏省科技厅重点研发计划(社会发展—面上项目)“秸秆废弃物净化重金属超标农田及灌溉水的关键技术应用研究(BE2015649)“,2015.7~2018.6 

[3] 上海市质量技术监督局上海市技术性贸易措施应对专项“国外智能服装安全性技术及对策研究(16TBT011)”2016.9~2018.8

[4] 上海市科学技术委员会研发平台专项 “上海材料基因组工程研究院(16DZ2260600)”,2017.1~2018.12

[5] 上海市科学技术委员会“农村土地典型污染物迁移归趋机制和生态风险评价技术研究(17DZ1202300)”,2017.7~2019.6


发表论文

33) Lei Hou, Siyi Bi, Hang Zhao, Yumeng Xu, Yuhang Mu, Yinxiang Lu*. Electroless plating Cu-Co-P polyalloy on UV/ozonolysis irradiated polyethylene terephthalate film and its corrosion resistance. Applied Surface Science 403 (2017) 248–259.

32) Siyi Bi, Hang Zhao, Lei Hou, Yinxiang Lu*, Comparative study of electroless Co-Ni-P plating on Tencel fabric by Co0-based and Ni0-based activation for electromagnetic interference shielding. Applied Surface Science 419 (2017) 465–475.

31) Lei Hou, Hang Zhao, Siyi Bi, Yumeng Xu, Yinxiang Lu*. Ultrasensitive and highly selective sandpaper-supported copper framework for non-enzymatic glucose sensor. Electrochimica Acta 248 (2017) 281–291.

30) Lei Hou, Hang Zhao, Yinxiang Lu*. Fabrication of user-defined copper conductive patterns onto paper substrate for flexible electronics by combining wax patterning with electroless plating. Journal of Materials Science: Materials in Electronics, 28 (2017) 4219–4228.

29) Lei Hou, Hang Zhao,Siyi Bi, Yinxiang Lu*. Fabrication of adhesion-enhanced and highly reliable copper circuits onto flexible substrates via a scribing–seeding–plating process. Journal of Materials Chemistry C, 5 (2017) 6281-6293.

28) 侯磊, 赵航, 吕银祥.化学镀法直写自催化金属图形的制备. 常州大学学报(自然科学版), 29 (2017) 22-26.

27) Hang Zhao, Lei Hou, Jixiang Wu, Yinxiang Lu*. Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating. Journal of Materials Chemistry C, 4 (2016) 7156-7164.

26) Lei Hou, Yinxiang Lu*, Hang Zhao. Preparation of selective conductive copper patterns by pen-onpaper writing combined with electroless plating. Journal of Materials Science: Materials in Electronics, 27 (2016) 7318–7326.

25) Hang Zhao, Lei Hou, Bijian Lan*, Yinxiang Lu*. Fabrication of conductive soybean protein fiber for electromagnetic interference shielding through electroless copper plating. Journal of Materials Science: Materials in Electronics, 27 (2016) 13300–13308.

24) Hang Zhao, Lei Hou, Yinxiang Lu*. Electromagnetic shielding effectiveness and serviceability of the multilayer structured cuprammonium fabric/polypyrrole/copper (CF/PPy/Cu) composite. Chemical Engineering Journal, 297 (2016) 170–179.

23) 石国庆, 赵航, 吕银祥*. 直写纳米金墨水制备纸基柔性金属图形. 复旦学报(自然科学版), 2016, 55(2), 200-204.

22) Hang Zhao, Lei Hou, Yinxiang Lu*. Electromagnetic interference shielding of layered Linen fabric/Polypyrrole/Nickel (LF/PPy/Ni) composites. Materials & Design, 95 (2016) 97–106.

21) Hang Zhao, Yinxiang Lu*. Comparative study of electroless nickel film on different organic acidsmodified cuprammonium fabric (CF). Applied Surface Science, 362 (2016) 154-162

20) Hang Zhao, Yinxiang Lu*. An efficient method to functionalize soybean protein fiber for fuse wire application. Journal of Materials Science: Materials in Electronics, 26(11) (2015) 8616-8624.

19) Hang Zhao, Qian Liang, Yinxiang Lu*. Microstructure and Properties of Copper Plating on Citric Acid Modified Cotton Fabric. Fibers and Polymers, 16(3) (2015) 593-598.

18) Guoqing Shi, Wenlong Li, Yinxiang Lu*. Fe-based surface activator for electroless nickel deposition on polyester: Application to electromagnetic shielding. Surface & Coatings Technology, 253 (2014) 221-226.

17) Wenlong Li, Guoqing Shi, Yinxiang Lu*. Copper-catalyzed electroless nickel coating on poly(ethyleneterephthalate) board for electromagnetic application. International Journal of Materials Research, 105(8) (2014) 797-801.

16) Qian Liang, Yinxiang Lu*. Copper/bamboo fabric composite prepared via a silver catalytic electroless deposition process for electromagnetic shielding, International Journal of Materials Research, 104(9) (2013) 912-917.

15) Yinxiang Lu *, Liang Qian, Li Wenlong. Fabrication of copper/modal fabric composites through electroless plating process for electromagnetic interference shielding. Materials Chemistry and Physics 140(2-3) (2013) 553-558.

14) Longlong Xue, Qian Liang, Yinxiang Lu*. Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate. Journal of Materials Science: Materials in Electronics 24(7) (2013) 2211-2217.

13) Yinxiang Lu*, Liang Qian. Removal of Pb(II) from Vanillin Solution by Acid-modified Cattail Biomass. BioResources 8(2) (2013) 2631-2640.

12) Wenlong Li, Yinxiang Lu*. Adsorption study of Pb(II) by chemically modified cattail stem. Desalination and Water Treatment 51 (2013) 6824–6836.

11) Yinxiang Lu*, Qian Liang, Longlong Xue. Electroless nickel deposition on silane modified bamboo fabric through silver, copper or nickel activation. Surface & Coatings Technology 206   (2012) 3639-3644.

10) Yinxiang Lu*, Longlong Xue. Electromagnetic interference shielding, mechanical properties and water absorption of copper/bamboo fabric (Cu/BF) composites. Composites Science and Technology 72 (2012) 828-834.

9) Yinxiang Lu*, Qian Liang, Longlong Xue. Palladium-free catalytic electroless copper deposition on bamboo fabric: Preparation, morphology and electromagnetic properties. Applied Surface Science 258 (2012) 4782-4787.

8) Yinxiang Lu*, Longlong Xue, Feng Li. Adhesion enhancement between electroless nickel and polyester fabric by a palladium-free process. Applied Surface Science 257 (2011) 3135–3139.

7) Yinxiang Lu. Structure of Methyl N-(4-methoxyphenylmethyl)-N#-cyanocarbamimidothioate and Methyl N-[1-(phenylmethyl)-4-piperidinyl]-N#-cyanocarbamimidothioate. Journal of Chemical Crystallography 41 (2011) 1395-1399.

6) Yinxiang Lu. Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition. Applied Surface Science 256 (2010) 3554–3558.

5) Yinxiang Lu*, Suhua Jiang*, Yongming Huang. Ultrasonic-assisted electroless deposition of Ag on PET fabric with low silver content for EMI shielding. Surface & Coatings Technology 204 (2010) 2829–2833.

4) Yinxiang Lu*, Longlong Xue, Feng Li. Silver nanoparticle catalyst for electroless Ni deposition and the promotion of its adsorption onto PET substrate. Surface & Coatings Technology 205 (2010) 519–524.

3) Yinxiang Lu*, Suhua Jiang*, Yongming Huang. Fabrication of high adhesive silver-coated PET electrode challenged by simulated body fluid (SBF) soaking. Synthetic Metals 160 (2010) 419–424.

2) Yinxiang Lu*, Altan Bolag, Jun-ichi Nishida, Yoshiro Yamashita*. Synthesis and characterization of 1,3,2-diazaboroine derivatives for organic thin-film transistor applications. Synthetic Metals 160 (2010) 1884–1891.

1) Yinxiang Lu. Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing. Applied Surface Science 255 (2009) 8430–8434.

 
授权专利

10) 吕银祥. 一种原位固化-移除土壤重金属的方法. 中国发明专利, 专利号: ZL 201410240226.9 (授权公告日: 2016.09.28)

9) 吕银祥. 一种电池级溴化锌的制备方法. 中国发明专利, 专利号: ZL 201210150024.6 (授权公告日: 2016.08.10)

8) 吕银祥. 一种蒲草基水处理材料的制备方法及其应用. 中国发明专利, 专利号: ZL 201210509374.7 (授权公告日: 2015.06.17)
7) 吕银祥, 薛龙龙, 粱倩.一种微米级线宽的柔性铜电极图形的制备方法. 中国发明专利, 专利号: ZL 201110323963.1 (授权公告日: 2014.04.02)
6) 吕银祥. 一种柔性医用银电极材料的制备方法. 中国发明专利,专利号: ZL 200910197538.5 (授权公告日: 2013.10.16)
5) 吕银祥. 一种低银负载电磁波屏蔽织物的制备方法. 中国发明专利,专利号: ZL 200910054882.9 (授权公告日: 2012. 05. 23)
4) 吕银祥. 一种N-羟基二酰亚胺的制备方法. 中国发明专利, 专利号: ZL 200810201278.X (授权公告日: 2011. 11. 2)
3) 吕银祥. 一种覆铜电磁波屏蔽织物的制备方法. 中国发明专利, 专利号: ZL 200910048743.5 (授权公告日: 2010. 12. 29)
2) 吕银祥. 一种二层柔性覆铜板的制备方法. 中国发明专利, 专利号: ZL 200910046662.1 (授权公告日: 2010. 11. 17)
1) 吕银祥, 徐伟. 一种以纳米金颗粒为电极的分子整流器. 中国发明专利, 专利号: ZL 200610023673.4 (授权公告日: 2009. 4. 29)
 

 
欢迎报考研究生,有意者可联系yxlu@fudan.edu.cn

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